Customized Various Thermal Conductive Silicone Pad Silicon Thermal Pad Heat Dissipation Silicone Pad For CPU
The TIF100-10-01U Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
TIF100-10-01U-TDS_EN_REV02-.pdf
Features:
> Good thermal conductive: 1.5 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
> Easy release construction
> Electrically isolating
> High durability
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> CPU
> Display card
> Mainboard/mother board
| Typical Properties of TIF100-10-01U Series |
| Color | Dark gray | Visual |
| Construction &Compostion | Ceramic filled silicone elastomer | *** |
| Specific Gravity | 2.1g/cc | ASTM D297 |
| Thickness range | 0.020"(0.5mm)~0.200"(5.0mm) | ASTM C351 |
| Hardness | 27 Shore 00 | ASTM 2240 |
| Dielectric Breakdown Voltage | >5000 VAC | ASTM D412 |
| Continuos Use Temp | -40 to 160℃ | *** |
| Outgassing(TML) | 0.35% | ASTM E595 |
| Dielectric Constant | 4.5 MHz | ASTM D150 |
| Volume Resistivity | 1.0X10¹² Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | equivalent UL |
| Thermal conductivity | 1.0W/m-K | ASTM D5470 |
Standard Thicknesses:
0.010" (0.25mm),0.020" (0.51mm),0.030" (0.76mm) ,0.040" (1.02mm),
0.050" (1.27mm),0.060" (1.52mm),0.070" (1.78mm),0.080" (2.03mm),
0.090" (2.29mm),0.100" (2.54mm),0.110" (2.79mm),0.120" (3.05mm),
0.130" (3.30mm),0.140" (3.56mm),0.150" (3.81mm),0.160" (4.06mm),
0.170" (4.32mm),0.180" (4.57mm),0.190" (4.83mm),0.200" (5.08mm)
Consult the factory alternate thickness.
Standard Sheets Sizes:
8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.
Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.
Company profile
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
FAQ
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
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